国家/地区 美国（4） 日本（3） 世界知识产权组织（3） 中国（2） 韩国（2）
IPC部 H（7） B（4） C（4）
IPC大类 H05（7）
IPC小类 H05K（6） H01L（5） C01B（3）
B32B（2） B82Y（2）
IPC C01B031/02（3） H05K007/20（3） B82Y030/00（2）
B82Y040/00（2） C01B031/04（2） H01L021/20（2）
H05K001/02（2） H05K001/03（2）
发明人 AHN J H（2） HONG B H（2） SONG Y I（2）
公开年 2010（4） 2011（2）
申请年 2009（7）
专利权人 SAMSUNG TECH.（2） UNIV SUNGKYU.（2） UNIV SUNGKYU.（2）

Flexible printed circuit board, has circuit pattern formed in base substrate, graphene film provided at side of base substrate, electric component connected with circuit pattern, and another graphene film placed in solder resist layer.

AHN J H, CHO S M, HONG B H, KIM H J, SONG Y I

Manufacture of graphene component for e.g. thin conductive film, involves forming oxide layer, metal catalytic layer, graphene, bonding layer and adhesive component in order on surface of base component, and removing catalytic layer.

AHN J H, BAE S K, HONG B H, SONG Y I

Heat radiation material for flexible printed circuit board, has heat radiation layer consisting of graphene layer and nanotube shaped layer formed on insulating substrate.

KAWAI C

Processing of graphene sheet material during manufacture of electronic device, involves inactivating edge portion of graphene sheet material by irradiating material with ultraviolet light in atmosphere containing substance.

ASANO K

Formation method of e.g. optoelectronic device, involves forming graphene layer on substrate, and layer of insulating material on top of graphene layer.

BALANDIN A A, GHOSH S, KOTCHETKOV D

Forming graphene layer used in e.g. transistors, solar panels, involves mixing carbon source with molten solvent, precipitating carbon source from solvent to form graphite layer, and separating graphite layer into several graphene layers.

SUNG C, HU S C, LIN I, YU C, SONG J

Printed electronic device such as integrated circuit and printed circuit board comprises substrate and layer of electrically conductive ink comprising functionalized graphene sheets and binder applied to the substrate.

AKSAY I A, CHEN C, CHIANG K S, KORKUT S, LETTOW J S, PRUDHOMME R K, CRAIN J M, AKSAY I, CHIANG K, LETTOW J, PRUDHOMME R, PRUD HOMME R K, KORKUT S A, PRUD H R K, AKSAY L A